|
Residual Stress
The specific purpose of the Division shall be:
- To further develop and advance the art of both residual stress measurement and analytical techniques through exchange of information concerning applications and methods of analysis and instrumentation.
- To provide improved and efficient technical coordination between the users of residual stress measurement apparatus, the manufacturers of these devices and end-users of residual stress data.
- To collect and disseminate technical information required for the application of empirical and analytical methods of determining residual stresses.
- To identify and sponsor, within the limitations noted below, projects involving residual stress measurement and data analysis; e.g., technical seminars, round-robin studies, publications and similar project as may be authorized by the Division.
|
| |
| Officers |
| Chair |
Keyu Li
Oakland University
kli@oakland.edu
|
| Secretary |
Gavin Horn
University of Illinois at Urbana-Champaign
ghorn@uiuc.edu |
Bylaws
Minutes of TD Meeting - June 2007
RESIDUAL STRESS DIVISION - Updated April 2007
The residual stress technical division (TD) is a group of volunteers that promote the study of residual stress, and encourage presentation of work during the annual SEM conferences. The TD operates as a framework for members to organize special working groups, discussion groups, or any other affiliations that will benefit the residual stress community. Any person interested in residual stress is invited to attend the TD meetings and take an active role by initiating activities.
In 2005, attendance at the technical division meeting was fairly low. The officers decided to make an effort to get more people to attend this meeting, by scheduling the TD meeting during lunch of the day most of the residual stress papers were being presented. Email invitations to join in the TD meeting were also sent out to all the authors, chairs, and co-chairs of RS sessions. In 2006, we had over 13 people attend the meeting, which was a very good turnout. The meeting began with self-introduction of those present, which generated about 40 minutes of good discussion on subjects regarding residual stress. Some of these discussions were continued that evening at an informal dinner. For the 2007 conference, we have followed the same procedure, and expect even greater participation, since all 3 of the RS sessions are scheduled for the same day.
Thirteen papers were accepted for the sessions in 2005 and 2006, with final presentations of 9 and 11, respectively, due to cancellations and rescheduling. Discussions of how to increase the number of presented papers took place during the TD meeting. One option that got some interest was to invite a “keynote” speaker to anchor the RS talks. Some suggestions were made for speakers, but no one actually volunteered to contact a keynote speaker. We may revisit this subject in 2007 at the TD meeting. We also discussed having special sessions that focused on a particular area of residual stress, such as measuring stresses in microelectronic materials. Gavin Horn was interested in pursuing some of his colleagues to submit papers for this session, but the abstract deadline beat him to the punch.
In 2006, there were several RS papers that were presented jointly with the inverse methods session. This was attempted again for 2007, but no abstracts were received. At this year’s TD meeting, we hope to encourage other ideas for increasing the number of papers presented.
Another idea for building a “critical mass” of attendees at the SEM conference is to organize a tour of a local facility that has ongoing research in residual stress. Some effort was made to solicit ideas for such a facility in Springfield MA for the 2007 meeting, but no champion for this effort was identified.
|
