Residual Stress

The specific purpose of the Division shall be:

To further develop and advance the art of both residual stress measurement and analytical techniques through exchange of information concerning applications and methods of analysis and instrumentation.
To provide improved and efficient technical coordination between the users of residual stress measurement apparatus, the manufacturers of these devices and end-users of residual stress data.
To collect and disseminate technical information required for the application of empirical and analytical methods of determining residual stresses.
To identify and sponsor, within the limitations noted below, projects involving residual stress measurement and data analysis; e.g., technical seminars, round-robin studies, publications and similar project as may be authorized by the Division.

Officers
*Chair*	Gary Schajer University of British Columbia schajer@mech.ubc.ca
*Vice Chair*	Gavin Horn University of Illinois at Urbana-Champaign ghorn@uiuc.edu

Bylaws

Minutes of TD Meeting - June 2007

Residual Stress Division - Updated May 2009

The mandate of Residual Stress Technical Division (RSTD) is to serve and consolidate research, promote new ideas, and disseminate results of experimental, analytical and numerical studies on residual stress. Residual stress analysis becomes as important as the measurement of usual mechanical properties in consideration of the fracture, fatigue, yielding, and other properties of materials, structures, manufactured parts, and welded and surface-treated elements.

In 2008, four members of the Society of Experimental Mechanics attended the technical division meeting. As expected, the attendance was relatively low due to the competing events in the same timeframe (ICRS in Denver in August 2008, and the Residual stress summit in Oak Ridge, TN in October 2008). The officers again made a strong push for attendance at this TD by scheduling on the day when most of the residual stress papers were being presented and sending e-mail invitations to join in the TD meeting to all the authors, chairs, and co-chairs of RS sessions. The RSTD meeting began with quick introductions for those present, which lead into a discussion of methods for increasing participation in the 2009 event by adding more keynote talks in specific focus areas and scheduling a preconference course. It was also suggested that the RSTD meeting back to the noon hour directly after residual stress morning sessions in order to increase participation. Attendance was significantly higher in the 2007 meeting with this timing. Unfortunately, this was not able to be scheduled for the 2008 (or 2009) meetings, but should be considered for future meetings. In 2008. the RSTD sponsored three sessions with good attendance (35, 25, and 15). The attendees in the TD meeting were very active and creative to propose several new ideas to attract more attendees into the TD and extend the TD’s activities.

The 2009 conferences marks the first time to have successfully invited two keynote lectures which were accepted by Dr. Drew Nelson at Stanford University and Dr. Mike Prime atLos Alamos National Laboratory. A special session of invited papers to celebrate the 75th anniversary of the hole-drilling technique was successfully planned and organized.A short course on “Hole-drilling Residual Stress Measurement” was successfully organized and to be given by Dr. Schajer, Dr. Mike Steinzig and Dr. Jerry Lord on Sunday, May 31, 2009.This year also marks the second successful Residual Stress in MEMS/NEMS session with the MEMS TD.

As a result of the preconference planning and networking, a total of five sessions have been planned for the 2009 SEM Annual Conference in Albuquerque in June; including a total of 18 papers (an increase of 63% from 2008) have been accepted

Optical Methods for Residual Stress as a General Track including a Keynote presentation by Dr. Drew Nelson.
Residual Stress and Reliability in MEMS and NEMSas part of the 10th International Symposium on MEMS & Nanotechnology

Co-organized with the MEMS & Nanotechnology Division.

Celebrating the 75th Anniversary of Hole Drilling Technique as a General Track with 4 “Invited Presentations”
Residual Stress Ias a General Track including a Keynote presentation by Dr. Mike Prime.
Residual Stress IIas a General Track

In 2009, the RSTD will also be sponsoring a preconference course titled “Hole-Drilling Residual Stress Measurements” by Gary Shajer, Mike Steinzig and Jerry Lord. In past years, a session was jointly hosted by the RSTD and Inverse Problems TD, which could be pursed again for the 2010 meeting. The detailed planning of the RSTD’s activities for 2010 will be discussed in the SEM 2009 TD meeting.

While the RSTD experienced a slight, but expected dip in attendance in 2008, the significant 63% increase in papers for the 2009 Conference, preconference course, and range of partnerships with other technical divisions has the RSTD well placed for a strong future within SEM.