Society for Experimental Mechanics

Electronic Packaging

The Technical Division on Electronic Packaging was established by SEM in 1993. Its mission is to serve as a forum for exchange of technical information on developments and applications in electronic packaging, with an emphasis on experimental mechanics. Due to the rapid evolution of semiconductor technology and the ever-increasing pressure to reduce costs and development cycle time, the role of mechanical analysis has been changed from a problem- solving (passive} mode to a predictive (active} mode, where the mechanical analysis is performed for design/performance optimization and reliability prediction of a new technology product at its conceptual stage of development The dependency of product development on the mechanical analysis has fostered increasing activity in experimental analysis both for specific studies and/or guidance of numerical modeling.

Officers
Chair	S. B. Park SUNY, Binghamton sbpark@binghamton.edu
Co-Chair	P. Lall Auburn University lall@eng.auburn.edu
Secretary	Z. Wang Catholic University of America wangz@cua.edu

SEM Electronic Packaging Division - Updated May 2007

EP Div. will offer two technical sessions in 2007
EP Division decided to organize the 5th Symposium of Experimental and Numerical Applications in Electronic Packaging in 2008. Ten sessions are planned.